ASIC solution, integrated circuit made according to customer’s requirements, offers an optimal solution in terms of specification and cost. Project starts with concept design and determination of specification which are made in close co-operation with the customer.  Process selection will be made based on product requirements, and customer preferences. As number of needed samples is limited, Multi project wafer (MPW) runs can be used for prototype manufacturing keeping the cost low. In total MAS has done several hundred ASIC and ASSP designs to silicon level for applications in mobile phones to industrial electronics. This allows also development of ASIC for projects where the predicted volumes are not enormous. As a financially solid company MAS can offer several options for the payment of the NRE.

If you have good idea for new product, but you don’t want to do ASIC, then ASSP is good choice. Application specific standard product (ASSP) is an integrated circuit designed for certain application. MAS offers the possibility for customers to suggest the specification and get the desired product. In a ASSP project MAS pays all the development cost but keeps the right to sell the product to any customer, although limitations can also be agreed.